Imikhiqizo
I-X-Ray Solution X5600 Microfocus X-Ray Inspection System Manufacturer
Inzuzo
| 1: I-semiconductor | 2: Ugesi wezimoto | 3: PCB'A | 4: i-LED |
| 5: Ukuhlolwa kwe-BGA/QFN | 6: I-Aluminium die Casting | 7: isikhunta | 8: Izingxenye zikagesi nezemishini |
| 9: Imbewu yezolimo yebhayoloji | 10: Ingxenye yezokundiza | 11: Ihabhu lamasondo | 12: Intambo/I-USB/Ipulagi |
Imisebenzi kanye nezici
| Umsebenzi | Izinzuzo |
| Umtshina we-X-ray ungahamba ngendlela engu-Z, Ijubane letafula elihamba ngendlela ye-XY lingashintshwa. | Ibanga elikhudlwana lokutholwa eliphumelelayo, ukuthuthukisa ukukhuliswa kanye nokusebenza kahle kokutholwa komkhiqizo. |
| Ishubhu ye-X-ray yempilo ende, isondlo samahhala impilo yonke | Yamukela umthombo womhlaba we-X-ray waseJapane we-Hahamatsu ophezulu emhlabeni |
| Iphutha elingaphansi kuka-2.5μm lingatholwa.Ukunemba kokuphinda kokutholwa okuphezulu. | Kulula ukuhlukanisa ukugoba kocingo lwegolide nokuphuka kwephakheji ye-semiconductor. |
| I-CNC Measuring Function enamandla, ingahlola ngokuzenzakalelayo, uhlelo lokuhlola lungahlelwa. | Ifanele ukuhlolwa kwenani elikhulu futhi ithuthukise ukusebenza kahle kokutholwa. |
| Umzimba omncane, kulula ukuwubeka, indawo encane | Ingasetshenziswa kuma-laboratories, amakamelo wezinto zokwakha, njll. |
| Ukubuka kokuzulazula okukhulu, ithebula lizoya lapho uchofoza khona igundane. | Kulula kakhulu ukusebenza, thola ngokushesha ukonakala kwento futhi uthuthukise ukusebenza kahle kokutholwa |
Inzuzo Yohlelo Lokusebenza
● Imishini emincane, kulula ukuyifaka nokusebenza
● Isebenza ku-Chip, BGA/CSP, Wafer, SOP/QFN, SMT kanye ne-PTU emaphaketheni, Izinzwa kanye neminye imikhiqizo yezinkambu.
● Idizayini enesinqumo esiphezulu ukuze uthole isithombe esihle kakhulu ngesikhathi esifushane kakhulu.
● Ukuzulazula okuzenzakalelayo kwe-infrared kanye nomsebenzi wokumisa ungakhetha indawo yokudubula ngokushesha.
● Imodi yokuhlola ye-CNC engahlola ngokushesha nangokuzenzakalelayo uhlu lwamaphuzu amaningi.
● Ukuhlola okunama-engeli amaningi kwenza kube lula ukuhlola amaphutha esampula.
● Ukusebenza kwesofthiwe okulula, izindleko zokusebenza eziphansi
● Ukuphila isikhathi eside
I-Automatic Void Ratio Calculation
I-X5600 ingakhetha ngokushesha futhi imake ibhola elilodwa le-solder, noma ikhethe amabhola e-solder azohlolwa ngebhokisi le-matrix;ingakwazi ukukhomba ngesandla noma ngokuzenzakalelayo amabhola e-solder e-BGA futhi iqedele ukuhlola.Landela imihlahlandlela yesistimu ukuze uqedele kalula inqubo yokuhlola futhi uqinisekise imiphumela yokuhlola enembile nethembekile.
Amathuluzi okulinganisa
Ibanga, isilinganiso sebanga, ibanga lemigqa, i-engeli, uphawu lomcibisholo, indawo eyindilinga, ibanga lamaphoyinti, ibanga lezikhungo eziyindilinga, isiyingi, ipholigoni edwetshwe ngesandla, i-freeform edwetshwe ngesandla njll., ingangeza incazelo yombhalo.
Hardware Technical Imingcele
| Isixazululo se-X-rayX5600Hardware nemingcele technical | ||||
| H A R D W A R E | X-RAY tube | Uhlobo lweshubhu | Ishubhu ye-X-ray ye-microfocus evaliwe | |
| I-Voltage Range | 40-90kV | |||
| Ububanzi Bamanje | 10-200 μA | |||
| Usayizi wendawo yokugxila | 15μm | |||
| Indlela yokupholisa | Ukupholisa i-Convection | |||
| Umtshina | Uhlobo lomtshina | I-HD digital flat panel detector (FPD) | ||
| Inkambu yokubuka | 130mm*130mm | |||
| I-Pixel matrix | 1536 * 1536 amaphikseli | |||
| Ukukhuliswa | 80X | |||
| Isivinini sesithombe | 40fps | |||
| Isivinini sokuhlola nokunemba | Ukunemba kokuhlolwa okuphindaphindiwe | 3 um | ||
| Isivinini sokuhlola isofthiwe | 3.0s/iphoyinti (Ngaphandle kwesikhathi sokulayisha nesokukhipha) | |||
| Ithebula | Usayizi ojwayelekile | 380mm*240mm | ||
| Layisha umthamo | ≤5Kg | |||
| CNC izinhlelo | Amapharamitha wokuhlola wemikhiqizo ehlukene angagcinwa ngezigaba futhi abizwe noma kunini.Ungasetha umzila wokutholwa noma ukulandelana komkhiqizo owodwa noma eminingi, futhi uhlelo luqedela ngokuzenzakalelayo ukutholwa futhi lugcine izithombe. | |||
| Inkundla yokusebenza | Igundane, ikhibhodi, izindlela zokusebenza ezi-2 | |||
| Igobolondo | Ipuleti lokuhola elingaphakathi | Ipuleti lomthofu eliwugqinsi elingu-5 mm (imisebe yodwa) | ||
| Ubukhulu | L850mm×W1000mm×H1700mm | |||
| Isisindo | Cishe 750Kg | |||
| Amanye amapharamitha | Ikhompyutha | 24 amayintshi Isikrini esibanzi LCD/I3 CPU/2G Memory/200G hard disk I-PC yezimboni WIN10 64bits | ||
| Ukunikezwa kwamandla kagesi | I-AC220V 10A | |||
| Izinga lokushisa kanye nomswakama | 22±3℃ 50%RH±10%RH | |||
| Amandla aphelele | 1500W | |||
| Ukuphepha | Izinga lokuphepha ngemisebe | Yamukela isakhiwo sokuvikela insimbi-lead-steel.Noma isiphi isikhundla esingu-20mm ukusuka kugobolondo, imisebe≤1μSV/H, ngokuvumelana nezindinganiso zamazwe ngamazwe | ||
| Umsebenzi wokuvala ukuphepha | Amaswishi amabili omkhawulo wokuzwela okuphezulu asethwe endaweni yokuvula umnyango ukuze kulungiswe imishini.Uma umnyango usuvuliwe, ishubhu le-X-ray lizocisha ngokuzenzakalelayo. | |||
| Ukuvikelwa kokushintsha kwe-electromagnetic | Iwindi lokubuka linokushintsha kozibuthe, futhi iwindi lokubuka alikwazi ukuvulwa lapho ishubhu ye-X ray isesimweni sokusebenza. | |||
| Iwindi lokubuka | Ngewindi lokubuka, isampula ingabonwa ngokuqondile efasiteleni ngenkathi umshini usebenza. | |||
| Isitobhi esiphuthumayo | Isitobhi esiphuthumayo sibekwe endaweni evelele yekhonsoli yokusebenza kanye nendikimba yemishini, ingacindezelwa ukuze inqamule ngokushesha uhlelo lokuphakela amandla. | |||
| I-X-ray tube isivikelo esizenzakalelayo | Ngemuva kwemizuzu emihlanu umshini ungasebenzanga, ishubhu ye-X-ray izocisha ngokuzenzakalelayo futhi ingene esimweni sokuvikela. | |||
| Ukuvikelwa komshini okuzenzakalelayo | Uma noma yimuphi umnyango noma iwindi lomshini livuliwe, umshini ungena ngokushesha esimweni sokuvikela ukuvala shaqa, futhi noma yimuphi umsebenzi awukwazi ukwenziwa. | |||
Software nemingcele technical
| Isixazululo se-X-rayX5600Software nemingcele technicalIsofthiwe yokuhlaziya izithombe ze-X-ray enesici esigcwele, okuhlanganisa nokuthuthukisa ukugqama kwesithombe kanye nemisebenzi yokuhlunga, imisebenzi yokulinganisa, nezinhlelo ze-CNC | |||
| SO F T W A R E
| Ukwahlulela okubi kokushisela | I-BGA emfushane | Setha ngaphambilini izithombe ze-NG, isofthiwe iyaqhathanisa futhi ibona ngokuzenzakalelayo |
| I-solder ebandayo ye-BGA | Setha ngaphambilini izithombe ze-NG, isofthiwe iyaqhathanisa futhi ibona ngokuzenzakalelayo | ||
| Izindleko ze-BGA | Setha ngaphambilini izithombe ze-NG, isofthiwe iyaqhathanisa futhi ibona ngokuzenzakalelayo | ||
| I-solder yamanga ye-BGA | Setha ngaphambilini izithombe ze-NG, isofthiwe iyaqhathanisa futhi ibona ngokuzenzakalelayo | ||
| Umsebenzi we-CNC | Uhlelo lwemodi yokunyakaza (CNC) | Imingcele yokuhlola yemikhiqizo ehlukene, ingahlukaniswa futhi igcinwe, shayela noma nini | |
| Ingasetha umzila wokuhlola noma ukulandelana komkhiqizo owodwa noma eminingi | |||
| Iwindi lokuzula | Isithombe setafula siboniswa esikrinini ngesikhathi sangempela, Chofoza noma yikuphi ukuma kwesithombe ukuze ulawule ukunyakaza. | ||
| Isilinganiso se-Voids | Isilinganiso se-Voids rate | Ukulinganisa okwenziwa ngesandla/okuzenzakalelayo, imodi yokulinganisa eyodwa/amabhola amaningi.Izinga lendawo yebhamuza lingasethwa kusengaphambili ukuze lilinganiswe ngokuzenzakalelayo. | |
| Ukukhiqizwa kombiko | Umphumela wokwahlulela ungamakwa ngokuqondile esithombeni, noma ukhiqize ngokuqondile ifayela le-CSV noma idokhumenti yombiko ngokwemiphumela yokuhlaziya. | ||
| Umsebenzi wokulinganisa | Ukukalwa kwendawo | Setha ngaphambilini usayizi wendawo ejwayelekile, umsebenzi we-NG womkhiqizo womkhiqizo. | |
| Ukulinganisa usayizi | Ibanga, ukugoba komugqa wegolide, umthambeka, i-engeli, njll. | ||
| Ukulawula ukunyakaza | Ukuma okuzenzakalelayo | Amandla ku-table auto zero function, ukuhlela kabusha isistimu | |
| Ukuhlolwa kweqoqo | Ngenisa uhlelo lwangaphambi kokukhiqiza ukuze uthole umsebenzi wokumisa ozenzakalelayo osheshayo, olungele ukuhlolwa okukhulu nokuphathwa kochungechunge lomkhiqizo | ||
| Ukushintsha indawo yokubuka | Isixhumi esibonakalayo singashintshwa ngokushesha phakathi kwamayintshi angu-2 no-4 amayintshi ukuze kuqashelwe izidingo ezimbili zokuthola indawo enkulu yokuphequlula ukubuka kanye nokubhekwa kwemininingwane eyingxenye, ukonga isikhathi sokuthola nokuthuthukisa ukusebenza kahle kokutholwa. | ||
| Imodi yokulawula | Ukulawula okuzenzakalelayo kwe-CNC, ikhibhodi yokulawula okwenziwa ngesandla, igundane, izindlela ezi-3 ziyakhethwa. | ||
| Ukuma kwesiza | Ukubekwa kwe-laser | Ukuma kwe-laser yamachashazi abomvu, isiza esiphindwe kabili, kulula ukuyizulazula | |
| Isikhulisi sokuzulazula | Ingakhulisa izindawo zokuthola umkhiqizo efasiteleni lokuzulazula, okulula ukulithola ngokunembile futhi lithuthukise ukusebenza kahle kokutholwa. | ||
Ukulawula Ithebula
Isivinini setafula singashintshwa yibha yesikhala: isivinini esiphansi, esivamile nesiphezulu.
X, Y, Z ukunyakaza kwama-eksisi amathathu kanye ne-engeli ethambekele kulawulwa yikhibhodi
Ukubuka kwe-navigator enkulu, sula isithombe sokuzulazula, ithebula lizoya lapho uchofoza khona igundane.
Vele uchofoze igundane futhi ungabhala izinhlelo.
Ithebula lezinto lihamba ngo-X, Y ukuze limiswe;Ishubhu le-X ray lihamba eduze no-Z ukuze libekwe.
I-voltage kanye namanje isethwe yi-software.
Izilungiselelo zesithombe: ukukhanya, ukugqama, ukuzuza okuzenzakalelayo nokuchayeka
Abasebenzisi bangashintsha isikhathi sokumisa okwesikhashana sokuguqulwa kohlelo.
Uhlelo lokulwa nokushayisana lungakhulisa ukutsheka nokubhekwa kwezinto zokusebenza.
Ukuhlaziywa okuzenzakalelayo kobubanzi, ingxenye yesikhala, indawo kanye nokujikeleza kwe-BGA.
X-RAY izicelo
X-RAY izicelo
I-PCB BGA
Ikhamera ye-iPhone
I-Diode
Intambo yegolide ye-IC
Isixhumi
Intambo yokubopha ye-LED
Izimpawu ze-IC
Izimpawu ze-IC
Ukukhanya kwe-LED
Inzwa eshisayo
I-Diode capacitance
I-Soldering iron
I-iPhone mainboard
Chip igolide wire
Izibani zokukhanya ze-LED
Imojula ye-IGBT ye-semiconductor yamandla aphezulu
Izingubo zikanokusho zokubopha ama-voids
