Imikhiqizo
I-Panasonic SMT Chip Mounter NPM-D3
Isici
Ukukhiqiza kwendawo ephezulu enemigqa yokukhweza epheleleUkukhiqiza okuphezulu kanye nekhwalithi ngokuphrinta, ukubekwa kanye nokuhlanganiswa kwenqubo yokuhlola
Amamojula alungisekayo avumela ukusethwa komugqa oguquguqukayoIkhanda livumelana nezimo ngemisebenzi ye-plug-and-play.
Ukulawulwa okuphelele kwemigqa, phansi kanye nefekthri nge-software yesistimuUkwesekwa kohlelo lokukhiqiza ngokuqapha ukusebenza komugqa.
Isixazululo Somugqa Ophelele
Imigqa yemojuli yezinyathelo ezincane ngokufaka amakhanda okuhlola
Ihlinzeka ngokukhiqiza kwekhwalithi ephezulu ngokuhlola okusemgqeni
*1:I-PCB traverser conveyor izolungiselelwa ikhasimende.*2:Sicela uxhumane nommeleli wakho wokuthengisa ukuze uthole amaphrinta ahambisanayo kanye nemininingwane eyengeziwe.
Ulayini Wokukhiqiza Okuningi
Ukukhiqizwa okuxubile okunezinhlobo ezingaphansi zezinhlobo ezahlukene emugqeni ofanayo nakho kuhlinzekwa nge-conveyor ekabili.
Ukutholwa kanyekanye kokukhiqiza kwendawo ephezulu kanye nokubekwa okunembayo okuphezulu
Imodi yokukhiqiza ephezulu (Imodi yokukhiqiza ephezulu: VULIWE
Ubukhulu.isivinini: 84 000 cph *1 (IPC9850(1608):63 300cph *1 )/ Ukunemba kokubeka: ±40 μm
Imodi yokunemba okuphezulu (Imodi yokukhiqiza ephezulu: VALIWE
Ubukhulu.isivinini: 76 000 cph *1 / ukunemba kokubekwa: ±30 μm(Inketho: ±25μm *2)
*1:I-Tact ye-16NH × 2 ikhanda*2:Ngaphansi kwezimo ezicaciswe yi-Panasonic
Inhloko entsha yokubeka
 | Ikhanda elilula elingu-16-nozzle |
Isisekelo esisha esiqinile
 | Isisekelo sokuqina okuphezulu esisekela ukubekwa kwesivinini esikhulu / ukunemba |
Ikhamera yokubona okuningi
· Imisebenzi emithathu yokuqaphela ihlanganiswe ibe yikhamera eyodwa
· Ukuskena kokubonwa okusheshayo okuhlanganisa nokutholwa kobude bezingxenye
· Ingathuthukiswa isuka ku-2D iye kokucaciswayo kwe-3D
Ukukhiqiza okuphezulu - Isebenzisa indlela yokufaka kabili
Okunye, Okuzimele & Nokubekwa Okuxubile
Ukukhetha "Okunye" kanye "Nendlela Ezimele" yokubeka kabili ikuvumela ukuthi usebenzise kahle inzuzo ngayinye.
• Okunye :
Amakhanda angaphambili nangemuva enza ukubeka kuma-PCB emigwaqweni yangaphambili nangemuva ngokushintshana.
• Ezizimele :
Ikhanda langaphambili lenza ukubeka ku-PCB emzileni ongaphambili kanye nekhanda elingemuva lenze ukubekwa emzileni ongemuva.
Ukukhiqiza okuphezulu ngokubekwa okuzimele ngokugcwele
Kufinyelelwe ukubekwa okuzimele kwezingxenye zethreyi ngokuxhuma ngokuqondile ne-NPM-TT (TT2) .Ikwazi ukubekwa okuzimele ngokugcwele kwezingxenye zethreyi ezithuthukisa isikhathi somjikelezo wamaphakathi nosayizi omkhulu wokubekwa kwengxenye ngekhanda lenozzle engu-3.Okukhiphayo kwawo wonke umugqa kuyathuthukiswa.
Ukuncishiswa kwesikhathi sokushintsha kwe-PCB
Vumela i-PCB elindile engaphansi kuka-L=250mm* kumshini wokuhambisa okhuphuka nomfula ukuze unciphise isikhathi sokushintshisana se-PCB futhi uthuthukise ukukhiqiza.
*Lapho ukhetha ama-conveyor amafushane
Ukushintshwa okuzenzakalelayo kwezikhonkwane zokusekela (inketho)
Shintsha ngokuzenzakalelayo indawo yezikhonkwane zokusekela ukuze unike amandla ukushintsha okunganqamuki futhi usize ukulondoloza amandla omuntu namaphutha okusebenza.
Ukuthuthukiswa kwekhwalithi
Umsebenzi wokulawula ukuphakama kokubeka
Ngokusekelwe kudatha yesimo se-warpage ye-PCB kanye nedatha yokujiya yengxenye ngayinye ezobekwa, ukulawulwa kobude bokubekwa kuthuthukisiwe ukuze kuthuthukiswe ikhwalithi yokukhweza.
Ukuthuthukiswa kwezinga lokusebenza
Indawo yokuphakela mahhala
Ngaphakathi kwethebula elifanayo, okokuphakelayo kungasethwa noma yikuphi.Enye ukwaba kanye nokusetha iziphakeli ezintsha zokukhiqiza okulandelayo kungenziwa ngenkathi umshini usebenza.
Abaphakeli bazodinga ukufakwa kwedatha okungaxhunyiwe ku-inthanethi ngesiteshi sokusekela (inketho).
Ukuhlolwa Kwesoda (SPI) • Ukuhlolwa Kwengxenye (AOI) – Inhloko yokuhlola
Ukuhlolwa kwe-Solder
· Ukuhlolwa kokubukeka kwe-solder
Ukuhlolwa kwengxenye ekhweziwe
· Ukuhlolwa kokubukeka kwezingxenye ezifakiwe
Ukukhwezwa kwangaphambili kwento yangaphandle*1 ukuhlolwa
· Ukuhlolwa kwangaphambili kwezinto zangaphandle kwama-BGA
· Ukuhlolwa kwento yangaphandle ngaphambi kokubekwa kwecala elivaliwe
*1: Ihloselwe izingxenye ze-chip (ngaphandle kwe-chip engu-03015 mm ).
I-SPI ne-AOI ukushintsha okuzenzakalelayo
· Ukuhlolwa kwe-Solder nengxenye kushintsha ngokuzenzakalelayo ngokuya ngedatha yokukhiqiza.
Ukuhlanganiswa kwedatha yokuhlola nokubekwa
· Umtapo wolwazi wengxenye ephethwe emaphakathi noma ukuxhumanisa idatha akudingi ukugcinwa kwedatha ezimbili zenqubo ngayinye.
Isixhumanisi esizenzakalelayo solwazi lwekhwalithi
· Ulwazi oluxhumeke ngokuzenzakalelayo lwekhwalithi yenqubo ngayinye lusiza ukuhlaziya imbangela yokukhubazeka kwakho.
I-Adhesive Dispensing - Ikhanda elikhiphayo
Indlela yokukhipha yohlobo lwe-screw
· I-NPM ye-Panasonic inomshini ojwayelekile wokukhipha i-HDF, oqinisekisa ukukhishwa kwekhwalithi ephezulu.
Isekela amaphethini okusabalalisa amachashazi/umdwebo
· Inzwa yokunemba okuphezulu (inketho) ikala ukuphakama kwe-PCB yendawo ukuze kulinganiswe ukuphakama kokukhipha, okuvumela ukusabalalisa okungaxhunywanga ku-PCB.
Ukubekwa kwekhwalithi ephezulu - uhlelo lwe-APC
Ilawula ukuhlukahluka kuma-PCB nezingxenye, njll. ngokomugqa ukuze kuzuzwe ukukhiqizwa kwekhwalithi.
I-APC-FB*1 Impendulo emshinini wokuphrinta
● Ngokusekelwe kudatha yokulinganisa ehlaziyiwe kusukela ekuhlolweni kwe-solder, ilungisa izindawo zokuphrinta.(X,Y,θ)
I-APC-FF*1 Idlulisele phambili emshinini wokubeka
· Ihlaziya idatha yesilinganiso sokuma kwe-solder, futhi ilungise izindawo zokubeka ingxenye (X, Y, θ) ngokufanele.Izingxenye ze-Chip (0402C/R ~)Ingxenye yephakheji (QFP, BGA, CSP)
I-APC-MFB2 Feedforward ku-AOI/Impendulo emshinini wokubeka
· Ukuhlolwa kwesikhundla ku-APC offset position
· Uhlelo luhlaziya idatha yokulinganisa indawo ye-AOI, lulungise indawo yokubeka (X, Y, θ) , futhi ngaleyo ndlela lugcine ukunemba kokubeka.Ihambisana nezingxenye ze-chip, izingxenye eziphansi zama-electrode kanye nezingxenye zomthofu*2
*1 : I-APC-FB (impendulo) /FF (i-feedforward) : Umshini wokuhlola we-3D wenye inkampani nawo ungaxhunywa.(Sicela ubuze omele abathengisi bendawo ukuze uthole imininingwane.)*2 : APC-MFB2 (i-mounter feedback2) : Izinhlobo zezingxenye ezisebenzayo ziyahlukahluka kumthengisi we-AOI kuya komunye.(Sicela ubuze omele abathengisi bendawo ukuze uthole imininingwane.)
Inketho yokuqinisekisa ingxenye - Isiteshi sokusekela sokusetha ungaxhunyiwe ku-inthanethi
Ivimbela amaphutha okusetha ngesikhathi sokushintsha Inikeza ukwanda kokusebenza kahle kokukhiqiza ngokusebenza okulula
*Izikena ezingenantambo nezinye izesekeli ezizohlinzekwa yikhasimende
· Ivimbela kusengaphambili ukubekwa kabi kwengxenyeIvimbela ukungahambi kahle ngokuqinisekisa idatha yokukhiqiza ngolwazi lwebhakhodi yezingxenye zokushintsha.
· Umsebenzi wokuvumelanisa idatha yokusetha ngokuzenzakalelayoUmshini ngokwawo uyaqinisekisa, ususa isidingo sokukhetha idatha yokusetha ehlukene.
· Umsebenzi we-InterlockNoma yiziphi izinkinga noma ukuphela kwesikhathi ekuqinisekiseni kuzomisa umshini.
· Umsebenzi wokuzulazulaUmsebenzi wokuzulazula ukwenza inqubo yokuqinisekisa iqondakale kalula.
Ngeziteshi zosekelo, ukusethwa kwenqola ephakelayo engaxhunyiwe ku-inthanethi kungenzeka ngisho nangaphandle kwendawo yokukhiqiza.
· Izinhlobo ezimbili zokusekela ziyatholakala.
Ikhono lokushintsha - Inketho yokushintsha ngokuzenzakalelayo
Ukusekela ukushintsha (idatha yokukhiqiza nokulungiswa kobubanzi besitimela) kunganciphisa ukulahleka kwesikhathi
· I-PCB ID yokufunda ngohlobo lomsebenzi wokufunda ngaphakathi kwe-ID ye-PCB iyakhetheka phakathi kwezinhlobo ezi-3 zesithwebuli sangaphandle, ikhamera yekhanda noma ifomu lokuhlela
Ikhono lokushintsha - Inketho yokusetha i-Feeder navigator
Kuyithuluzi lokusekela lokuzulazula kwinqubo yokusetha ephumelelayo.Ithuluzi lifaka phakathi inani lesikhathi elisithathayo ukwenza nokuqedela imisebenzi yokusetha lapho ilinganisa isikhathi esidingekayo sokukhiqiza futhi inikeze isisebenzisi imiyalelo yokusetha.Lokhu kuzobonisa ngeso lengqondo futhi kuqondise imisebenzi yokusetha phakathi nokusetha ulayini wokukhiqiza.
Ukuthuthukiswa kwezinga lokusebenza - Izingxenye zinikeza inketho ye-navigator
Ithuluzi lokusekela ukunikezwa kwengxenye elizulazula okubalulekile kokunikezwa kwengxenye okusebenzayo.Icabangela isikhathi esisele kuze kuphele ingxenye nendlela ephumelelayo yokunyakaza komsebenzisi ukuze ithumele imiyalelo yokunikezwa kwengxenye ku-opharetha ngamunye.Lokhu kuzuza ukunikezwa kwengxenye esebenza kahle kakhulu.
*I-PanaCIM idingeka ukuthi ibe nabaqhubi abaphethe ukuhlinzeka ngezingxenye emigqeni eminingi yokukhiqiza.
Umsebenzi wokuxhumana wolwazi we-PCB
Ulwazi lokuqashelwa kwamamaki olwenziwa emshinini wokuqala we-NPM emgqeni ludluliselwa emishinini ye-NPM eyehla nomfula. Okunganciphisa isikhathi somjikelezo kusetshenziswa ulwazi oludlulisiwe.
Uhlelo Lokudala Idatha – NPM-DGS (Imodeli No.NM-EJS9A)
Leli iphakethe lesofthiwe elihlinzeka ngokuphathwa okudidiyelwe komtapo wolwazi wengxenye nedatha ye-PCB, kanye nedatha yokukhiqiza ekhulisa imigqa yokukhweza ngokusebenza okuphezulu nokusebenza kahle.
*1:Ikhompuyutha kufanele ithengwe ngokuhlukana.*2:I-NPM-DGS inemisebenzi emibili yokuphatha yezinga lephansi nelayini.
CAD ukungenisa
Ikuvumela ukuthi ungenise idatha ye-CAD futhi uhlole i-polarity, njll., esikrinini.
Ukuthuthukisa
Ibona ukukhiqiza okuphezulu futhi ikuvumela ukuthi udale amalungu afanayo afanayo.
Umhleli we-PPD
Buyekeza idatha yokukhiqiza ku-PC ngesikhathi sokukhiqiza ukuze unciphise ukulahleka kwesikhathi.
Umtapo wezincwadi
Ivumela ukuphathwa okuhlangene komtapo wengxenye ofaka ukukhweza, ukuhlola nokukhipha.
Uhlelo Lokudala Idatha – Ikhamera engaxhunyiwe ku-inthanethi (inketho)
Idatha yengxenye ingadalwa ungaxhunyiwe ku-inthanethi ngisho nalapho umshini usebenza.
Sebenzisa ikhamera yomugqa ukuze udale idatha yengxenye.Izimo zokukhanyisa nesivinini sokubonwa kungaqinisekiswa kusenesikhathi, ngakho kunomthelela ekuthuthukisweni kokukhiqiza nekhwalithi.
 | Iyunithi Yekhamera Engaxhunyiwe ku-inthanethi |
Uhlelo Lokudala Idatha - I-DGS Automation (inketho)
Imisebenzi yendlela yokwenza ezenzakalelayo yehlisa amaphutha okusebenza kanye nesikhathi sokudala idatha.
Imisebenzi eyenziwa mathupha ingenziwa ngokuzenzakalelayo. Ngokusebenzisana nesistimu yekhasimende, imisebenzi evamile yokudala idatha ingancishiswa, ngakho kunomthelela ekwehliseni okukhulu kwesikhathi sokulungiselela ukukhiqiza. Kuphinde kuhlanganise nomsebenzi wokulungisa ngokuzenzakalelayo izixhumanisi ne-engeli ye indawo yokukhweza (Virtual AOI).
Isibonelo salo lonke isithombe sesistimu
Imisebenzi ezenzakalelayo (ingcaphuno)
·CAD ukungenisa
·Ukusetha uphawu lwe-offset
·I-PCB chamfering
·Ukulungiswa kokungaqondani kahle kwendawo yokukhuphuka
·Ukudala umsebenzi
·Ukwenza ngcono
·Okukhiphayo kwe-PPD
·Landa
Uhlelo Lokudala Idatha - Ukuthuthukisa ukusetha (inketho)
Ekukhiqizeni okubandakanya amamodeli amaningi, ukusethwa kwemithwalo yemisebenzi kuyacatshangelwa futhi kuthuthukiswe.
Ku-PCB engaphezu kweyodwa eyabelana ngokubekwa kwengxenye evamile, ukusetha okuningi kungase kudingeke ngenxa yokushoda kwamayunithi we-suppy. Ukuze kuncishiswe umthwalo wokusetha odingekayo esimweni esinjalo, le nketho ihlukanisa ama-PCB abe amaqembu afanayo okubekwa kwezingxenye, ikhetha ithebula ( s) yokusetha futhi ngaleyo ndlela iguqule ukusebenza kokubeka ingxenye. Inikela ekuthuthukiseni ukusebenza kokusetha kanye nokunciphisa isikhathi sokulungiselela ukukhiqiza ukuze amakhasimende akhiqize izinhlobo ezihlukahlukene zemikhiqizo ngamanani amancane.
Isibonelo
Ukuthuthukiswa kwekhwalithi - Isibukeli solwazi lwekhwalithi
Lena isofthiwe eklanyelwe ukusekela ukuqonda amaphuzu aguqukayo nokuhlaziywa kwezinto ezingalungile ngokuboniswa kolwazi oluhlobene nekhwalithi (isb., izindawo zokuphakela ezisetshenzisiwe, amanani okushintshaniswa okubonwayo kanye nedatha yezingxenye) nge-PCB ngayinye noma indawo yokubeka.Uma kwenzeka kwethulwa inhloko yethu yokuhlola, izindawo ezinokukhubazeka zingaboniswa ngokuhambisana nolwazi oluhlobene nekhwalithi.
Iwindi lokubuka ulwazi lwekhwalithi
Isibonelo sokusebenzisa isibukeli solwazi lwekhwalithi
Ihlonza okokuphakelayo okusetshenziselwa ukukhweza amabhodi esekethe anesici.Futhi uma, ngokwesibonelo, unokungalungi kahle okuningi ngemva kokuhlanganisa, izici zokukhubazeka zingacatshangwa ukuthi zibangelwa;
1.amaphutha okuhlanganisa (ukuchezuka kwephimbo kuvezwa amanani okushintshana okubonwa)
2.ushintsho ekubunjweni kwengxenye (inqwaba ye-reel engalungile noma abathengisi)
Ngakho ungathatha isinyathelo esisheshayo ekulungiseni ukungaqondi kahle.
Ukucaciswa
| I-ID yemodeli | I-NPM-D3 | |||||
| Ikhanda elingemuva Ikhanda elingaphambili | Ikhanda elingasindi elingu-16-nozzle | 12-nozzle ikhanda | 8-nozzle ikhanda | 2-nozzle ikhanda | Ikhanda elikhiphayo | Alikho ikhanda |
| Ikhanda elilula elingu-16-nozzle | I-NM-EJM6D | I-NM-EJM6D-MD | I-NM-EJM6D | |||
| 12-nozzle ikhanda | ||||||
| 8-nozzle ikhanda | ||||||
| 2-nozzle ikhanda | ||||||
| Ikhanda elikhiphayo | I-NM-EJM6D-MD | I-NM-EJM6D-D | ||||
| Inhloko yokuhlola | I-NM-EJM6D-MA | I-NM-EJM6D-A | ||||
| Alikho ikhanda | I-NM-EJM6D | I-NM-EJM6D-D | ||||
| PCB ubukhulu*1(mm) | Imodi yemigqa emibili | L 50 x W 50 ~ L 510 x W 300 |
| Imodi eyodwa | L 50 x W 50 ~ L 510 x W 590 | |
| PCBexchangetime | Imodi ekabili | 0 s* *Awekho ama-0 uma isikhathi somjikelezo singamasekhondi angu-3.6 noma ngaphansi |
| Imodi eyodwa | 3.6 s* *Lapho ukhetha amaconveyor amafushane | |
| Umthombo kagesi | 3-isigaba AC 200, 220, 380, 400, 420, 480 V 2.7 kVA | |
| Umthombo we-pneumatic *2 | 0.5 MPa, 100 L/min (ANR) | |
| Ubukhulu *2 (mm) | W 832 x D 2 652 *3 x H 1 444 *4 | |
| IMisa | 1 680 kg (Ngomzimba omkhulu kuphela:Lokhu kuyahluka kuye ngokucushwa kwenketho.) | |
| Inhloko yokubeka | Ikhanda elingasindi elingu-16-nozzle (Ikhanda ngalinye) | 12-nozzle ikhanda (Ikhanda ngalinye) | 8-nozzle ikhanda (Ikhanda ngalinye) | 2-nozzle ikhanda (Ikhanda ngalinye) | ||
| Imodi yokukhiqiza ephezulu [ON] | Imodi yokukhiqiza ephezulu [OFF] | |||||
| Ubukhulu.isivinini | 42 000 cph(0.086 s/ chip) | 38 000 cph(0.095 s/ chip) | 34 500 cph(0.104 s/ chip) | 21 500 cph(0.167 s/ chip) | 5 500 cph (0.655 s/ chip)4 250 cph (0.847 s/ QFP) | |
| Ukunemba kokubeka (Cpk □1) | ± 40 µm/chip | ±30 μm / chip(±25 μm / chip*5) | ±30 μm / chip | ± 30 µm/chip ± 30 µm/QFP □ 12mm ukuya □ 32mm ± 50 □ 12mm Ngaphansiµm/QFP | ± 30 µm/QFP | |
| Ubukhulu bengxenye (mm) | 0402 chip*6 kuya ku-L 6 x W 6 x T 3 | 03015*6*7/0402 chip*6 kuya ku-L 6 x W 6 x T 3 | 0402 chip*6 kuya ku-L 12 x W 12 x T 6.5 | 0402 chip*6 kuya ku-L 32 x W 32 x T 12 | 0603 chip kuya ku-L 100 x W 90 x T28 | |
| Componentsupply | Ukuthepha | Itheyiphu: 4/8/12/16/24/32/44/56 mm | ||||
| Ukuthepha | Ubukhulu.68 (4, 8 mm itheyiphu, iroli elincane) | |||||
| Induku | I-Max.16 (Isiphakeli senduku eyodwa) | |||||
| Ithreyi | Ubuningi.20 (isiphakeli sethreyi ngayinye) | |||||
| Ikhanda elikhiphayo | Ukukhipha ichashazi | Ukukhipha imidwebo |
| Isivinini sokukhipha | 0.16 s/chashazi (Isimo : XY=10 mm, Z=ngaphansi kuka-4 mm ukunyakaza, Akukho θ ukuzungezisa) | 4.25 s/ingxenye (Isimo: 30 mm x 30 mm ekhoneni elikhiphayo)*8 |
| Ukunemba kwendawo yokunamathela(Cpk □1) | ± 75 μ m / ichashazi | ± 100 μ m /ingxenye |
| Izingxenye ezisebenzayo | 1608 chip ku-SOP, PLCC, QFP, Isixhumi, BGA, CSP | SOP, PLCC, QFP, Isixhumi, BGA, CSP |
| Inhloko yokuhlola | Ikhanda lokuhlola le-2D (A) | Ikhanda lokuhlola le-2D (B) | |
| Isixazululo | 18µm | 9 µm | |
| Buka usayizi (mm) | 44.4 x 37.2 | 21.1 x 17.6 | |
| Inspectionb processing time | SolderInspection*9 | 0.35s/ Buka usayizi | |
| Ukuhlola Ingxenye*9 | 0.5s/ Usayizi wokubuka | ||
| Inspectionobject | SolderInspection *9 | Ingxenye ye-chip : 100 μm x 150 μm noma ngaphezulu (0603 mm noma ngaphezulu)Ingxenye yephakheji : φ150 μm noma ngaphezulu | Ingxenye ye-chip : 80 μm x 120 μm noma ngaphezulu (0402 mm noma ngaphezulu)Ingxenye yephakheji : φ120 μm noma ngaphezulu |
| Ukuhlola Ingxenye *9 | I-square chip (0603 mm noma ngaphezulu), SOP, QFP (iphimbo elingu-0.4 mm noma ngaphezulu), CSP, BGA, Aluminium electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 | I-square chip (0402 mm noma ngaphezulu), i-SOP, i-QFP (iphimbo elingu-0.3 mm noma ngaphezulu), i-CSP, i-BGA, i-Aluminium electrolysis capacitor, ivolumu, i-Trimmer, ikhoyili, isixhumi*10 | |
| Izinto zokuhlola | SolderInspection *9 | Ukuguquguquka, ukufiphala, ukungaqondi kahle, umumo ongajwayelekile, ibhuloho | |
| Ukuhlola Ingxenye *9 | Akukho, shintsha, ukupheqa, i-polarity, ukuhlolwa kwento yangaphandle *11 | ||
| Ukunemba kwendawo yokuhlola *12( Cpk □1) | ± 20 μm | ± 10 μm | |
| Cha. yokuhlola | SolderInspection *9 | ||
| Ukuhlola Ingxenye *9 | |||
| *1 : | Ngenxa yomehluko kunkomba yokudlulisa ye-PCB, ukuxhumana okuqondile ne-NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) ama-specs welayini ekabili akukwazi ukusungulwa. |
| *2 : | Okomzimba oyinhloko kuphela |
| *3 : | Ubukhulu D kufaka phakathi okokuphakelayo kwethreyi : 2 683 mmUbukhulu D kufaka phakathi inqola yokuphakelayo : 2 728 mm |
| *4 : | Ngaphandle kwemonitha, umbhoshongo wesignali kanye nekhava yefeni yesilingi. |
| *5 : | ±25 μm inketho yokusekela yokubeka.(Ngaphansi kwezimo ezicaciswe yiPanasonic) |
| *6 : | I-chip engu-03015/0402 mm idinga umlomo/isiphakeli esithile. |
| *7 : | Ukusekelwa kokubeka i-chip engu-03015 mm kuyakhethwa.(Ngaphansi kwezimo ezicaciswe i-Panasonic:Ukunemba kokubekwa ±30 μm / chip) |
| *8 : | Isikhathi sesilinganiso sobude be-PCB esingu-0.5s sifakiwe. |
| *9 : | Ikhanda elilodwa alikwazi ukusingatha ukuhlolwa kwe-solder nokuhlolwa kwengxenye ngesikhathi esifanayo. |
| *10 : | Sicela ubheke ibhukwana lemininingwane ukuze uthole imininingwane. |
| *11 : | Into yangaphandle iyatholakala ezingxenyeni ze-chip.(Ngaphandle kwe-chip 03015 mm) |
| *12 : | Lokhu ukunemba kwesikhundla sokuhlola i-solder kukalwa yisithenjwa sethu sisebenzisa ingilazi yethu ye-PCB ukulinganisa indiza.Ingase ithintwe ukushintsha okungazelelwe kwezinga lokushisa elizungezile. |
*Isikhathi sobuhlakani bokubeka, isikhathi sokuhlola kanye namanani okunemba kungase kwehluke kancane kuye ngezimo.
*Sicela ubheke ibhukwana lemininingwane ukuze uthole imininingwane.
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