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Incazelo
Ikhwalithi ephezulu nokukhiqiza okuphezulu..Ukuqhubeka nokuphishekela ukuphrinta kwekhwalithi ephezulu "okuyisisekelo sekhwalithi ukuphrinta"
●Amandla okugcwalisa asezingeni eliphezulu kanye nokukhiqiza okuphezulu
Ngaphandle kokunyathelisa okuqhubekayo, ukulawulwa kwezimoto ze-vertical squeegee motions kwenza ukulawula kwedijithali ngesikhathi sokuvukela kwe-squeegee futhi kuqaphela ukukhiqiza okuphezulu.Leli khanda livimbela ukuchichima kwe-solder ngaphandle kwe-squeegee kanye nokulenga kwe-solder kubangela ukuxubana komoya.
● PC board board support
Izimo ze-solder ezizinzile zingaphrintwa kuzo zonke izindawo zebhodi ngenxa yokusekela amaphethelo ebhodi afinyelela kude.
Ukusebenza okulula..Ukuphishekela okwengeziwe koshintsho ngesivinini esikhulu
●Ukuzulazula koshintsho
Inqubo yokusetha isibonisi inganciphisa isikhathi sokulungiselela ukukhiqizwa
● Ukusebenza okulula
Izimo zokuphrinta zingasethwa ngokuzenzakalelayo ngokucacisa izinhlobo zokukhiqiza
● Umsebenzi wokuthinta okukodwa wokushintsha i-squeegee
Ama-squeegees angashintshwa ngokusebenza kokuthinta okukodwa
Uhlu olubanzi lwezinhlelo zokusebenza
● Ukunikezwa kwe-solder okuzenzakalelayo (inketho)
Ukuphrinta okuqhubekayo isikhathi eside kungenzeka ngokunikezwa kwe-solder okuzenzakalelayo kuma-stencil
● Umsebenzi wokuhlola i-solder (inketho)
Ukungaboni ngaso linye, ukuhlanganisa ibhuloho, ukufiphala nokuphuma kwamanzi kuhlolwa ngekhamera yokuqaphela ye-PCB.
●Usekelo lwempendulo yomphumela wokuhlola (inketho)*
Ngokuya ngedatha yokulungiswa kokuphrinta okuguquliwe okuhlaziywe ngokuhlola kokunamathisela kwe-solder (idatha yokulungiswa kwe-APC), ilungisa izindawo zokuphrinta (X,Y,θ)
● Ukukhululwa kwe-mask vacuum yokusekelwa (inketho)
Imaski yokuphrinta ingavalwa ngesikhathi sokuphrinta nokukhishwa kwetafula lokusekela.
Ingakwazi ukunika amandla ukuphrinta okuzinzile ngokususa i-shift nenduku yemaski.
●Ukutholwa kobude be-stencil (inketho)
Izinqubo ze-Laser zingakwazi ukuthuthukisa ukuxhumana kwamabhodi e-PC ngama-stencil ukuze kuhlinzekwe ukuphrinta okuzinzile
*Imishini yokuhlola ye-3D yenye inkampani nayo ingaxhunywa.Sicela ubuze nommeleli wakho wokuthengisa ukuze uthole imininingwane eyengeziwe.
Ukucaciswa
I-ID yemodeli | SP70 |
Imodeli No. | I-NM-EJP3A |
Ubukhulu be-PCB (mm) | L 50 × W 50 kuya ku-L 510 × W 460 *1 |
Isikhathi somjikelezo | 6.8 s + isikhathi sokuphrinta ( Usayizi webhodi : 510 × 460 mm) 5.2 s + isikhathi sokuphrinta ( Usayizi webhodi : 330 × 250 mm) |
Ukunemba kokuphrinta | ±20 µm |
Ukuphindaphinda | ±5.0 µm |
Ubukhulu bozimele besikrini (mm) | L 736 × W 736L 650 × W 550 , L 600 × W 550 |
Umthombo kagesi | 3-isigaba AC 200 V *2 2.0 kVA *3 |
Umthombo womoya | 0.5 MPa, 30 L/min (ANR) |
Ubukhulu (mm) | W 1 680 × D 2 070 *4 × H 1 430 *5 |
IMisa | 1 730 kg |
*1: Osayizi be-PCB abasebenzayo: ubuningi.L 580 mm x W 508 mm
*2:Ihambisana ne-3-isigaba 220 / 380 / 400 / 420 / 480 V
*3:Kufaka i-blower ne-vacuum futha
*4:Bamba ubukhulu bangaphandle
*5:Ngaphandle kokuqapha kanye nombhoshongo wesignali
*Amanani afana nesikhathi somjikelezo nokunemba angahluka kuye ngezimo zokusebenza.
*Sicela ubheke ibhukwana elithi "Specification" ukuze uthole imininingwane.
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