Imikhiqizo
Imishini yokuhlola i-Micro focus X-ray X6000
Inzuzo
● Umthombo we-X-ray wamukela ishubhu ye-X ray yaseJapane ehamba phambili emhlabeni i-Hahamatsu, ephila isikhathi eside futhi engakhathali.
● Ukwamukela i-X-ray kusebenzisa isizukulwane esisha se-IRay 5-inch high-definition digital flat-panel detector, esusa iziqinisekisi zesithombe.
● Zulazula efasiteleni ngokuzenzakalelayo, lapho ufuna ukubona ukuthi uchofoze kuphi.
● Isiteji esikhulu esingu-420*420mm esinomthamo womthwalo ongu-15KG.
● Isistimu yokuxhuma i-eksisi enyakazayo enesivinini esilungisekayo.
● Uhlelo lokuhlonza lungahlelwa ukuze lubone ukutholwa okuzenzakalelayo kwenqwaba, futhi lwahlulele ngokuzenzakalelayo i-NG noma KULUNGILE.
● Ongakukhetha kokungu-360° okuphendukisayo kungasetshenziswa ukubuka umkhiqizo kuzo zonke izinhlangothi ukusuka kuma-engeli ahlukene.
● Ukusebenza kulula futhi kuyashesha, thola ngokushesha iphutha eliqondiwe, kanye namahora amabili okuqeqeshwa ukuze uqalise.
Ipharamitha
|
Umthombo we-X-ray | Ibhrendi | Japan Hamamatsu | |
| Uhlobo | Ivaliwe, Indawo egxile kakhulu | ||
| I-tube voltage | 90kV | ||
| I-tube yamanje | 200μA | ||
| Usayizi wendawo | 5mm | ||
| Umsebenzi | Ukushisa kuqala ngokuzenzakalelayo | ||
|
Umtshina wephaneli eyisicaba | Ibhrendi | IRay | |
| Indawo esebenzayo | 130mm*130mm | ||
| Usayizi wephikseli | awu 85m | ||
| Isixazululo | 1536*1536 | ||
| ukukalwa kwe fulemu | 20 ifreyimu/s | ||
| Isiteji se-carbon fibre | Usayizi weplatifomu | 420mm*420mm | |
| Ubukhulu be-pcb | 400mm*400mm | ||
| Umthwalo omkhulu | 15kg | ||
|
Umshini | Ukukhuliswa | Ukukhulisa iJiyomethri 200X | Ukukhulisa isistimu1500X |
| Isivinini sokuhlola esiphezulu | 3 s/iphuzu | ||
| Ubukhulu | L 1100mm, W 1000mm, H 1600mm | ||
| Isisindo sengqikithi | 1000kg | ||
| Amandla | I-AC110-220V 50/60HZ | ||
| Amandla amakhulu | 1300W | ||
| Ikhompyutha | I3-7100 CPU, 4G RAM, 240GB SSD | ||
| Bonisa | 24 寸 Isibonisi se-HDMI | ||
|
Ukuphepha | Ukuvuza kwemisebe | Alikho, izinga lamazwe ngamazwe: ngaphansi kwe-microsievert engu-1 ngehora. | |
| Iwindi lokubuka ingilazi eliholayo | Ingilazi eholayo ekhanyayo yokuhlukanisa imisebe ukuze ibuke into elinganisiwe. | ||
| Ukuphepha kokuxhumana kweminyango yangaphambili nengemuva | Lapho isicabha sesivuliwe, ishubhu le-X ray liyacishwa ngokushesha, futhi i-X-ray ayikwazi ukuvulwa lapho kuvulwa umnyango. | ||
| Iswishi yomnyango wokuphepha we-electromagnetic | Lapho i-X-ray ivuliwe, iyazikhiya futhi ayikwazi ukuvula umnyango. | ||
| inkinobho yezimo eziphuthumayo | Itholakala eduze kwendawo yokusebenza, cindezela ukuze ucime ngokushesha. | ||
| Ukuvikelwa kweshubhu ye-X-ray | Ngemva kokucisha i-X-ray, ungakwazi ukushiya isofthiwe eminye imisebenzi. | ||
Isofthiwe
|
imodyuli esebenzayo | Ukusebenza | Ikhibhodi negundane |
| I-X-ray tube control | I-X-ray ingavulwa noma ivalwe ngokuchofoza inkinobho ngegundane, futhi umthamo weshubhu wesikhathi sangempela namanani wamanje weshubhu ayaboniswa eduze kwayo.Umsebenzisi angachofoza izinkinobho zaphezulu naphansi, noma ahudule ibha yesilayidi, noma azifakele ukulungisa. | |
| Ibha Yesimo | Ngokuthi ukukhanya okubomvu nokuluhlaza kukhanye ngokushintshana, kwazisa isimo se-interlock kanye nesimo sokushisa kwangaphambili Isimo sokushintsha kwesimo kanye ne-X-ray. | |
| Ukulungiswa komphumela wesithombe | Ukukhanya, umehluko kanye nokuzuza kwesithombe kungalungiswa ngokukhululekile ukuze kuzuzwe ukwaneliseka Umphumela. | |
| Uhlu lomkhiqizo | Umsebenzisi angagcina okwamanje noma akhumbule indawo ye-axis engu-Z egcinwe ngaphambilini, ukukhanya, ukugqama, inzuzo kanye nezinye izinhlaka.Umkhiqizo ofanayo ungakhunjulwa ngokuqondile ngokuzayo ukuze uthuthukise ukusebenza kahle kokuhlola. | |
| Iwindi lokuzula | Ngemuva kokuthi ikhamera ithathe isithombe seplatifomu, chofoza kunoma yikuphi ukuma kwesithombe, futhi inkundla izonyakaza kuze kube yilapho isikhundla siboniswa esikrinini. | |
| Isimo se-eksisi yokunyakaza | Bonisa izixhumanisi zesikhathi sangempela. | |
| Imiphumela yokuhlolwa | Bonisa umphumela ngamunye wokulinganisa ngokulandelana (isilinganiso sebhamuza, ibanga, indawo engaphezulu Umkhiqizo nezinye izinto zokulinganisa ezisethwe ikhasimende). | |
| ukulawula isivinini | Isivinini esihambayo se-eksisi ngayinye singashintshwa ukuze sibe nesivinini esincane, isivinini esivamile kanye nesivinini esisheshayo. | |
|
Isilinganiso sesilinganiso sebhamuza | Ukubala okuzenzakalelayo | Chofoza amaphuzu amabili ukuze unqume unxande.Isofthiwe ithola ngokuzenzakalelayo futhi ilinganise imiphetho yebhola le-solder, amaphedi namabhamuza angaphakathi kunxande, futhi ingathola izinga lebhamuza lebhola le-solder, indawo yebhola le-solder, isiyingi, isilinganiso esiphezulu sebhamuza, ubude, ububanzi kanye nenye idatha , Futhi sebenzisa okubomvu nokuluhlaza. ukukhombisa NG noma KULUNGILE. |
| Imingcele yokulungisa | Umsebenzisi angakwazi ukulungisa i-threshold ye-grayscale, i-pixel, ukugqama, isihlungi sikasayizi namanye amapharamitha ukuze athole umphumela onembile wokubala okuzenzakalelayo. | |
| Engeza amabhamuza ngokwenza | Abasebenzisi bangadweba amapholigoni noma ihluzo zamahhala, ezibalwa ngokwezinga lebhamuza njengamabhamuza. | |
| Gcina imingcele | Umsebenzisi angagcina umkhawulo we-grayscale, i-pixel, ukugqama, isihlungi sikasayizi namanye amapharamitha webhamuza lamanje lokulinganisa, futhi umkhiqizo ofanayo ungabizwa ngokuqondile ngokuzayo ukuze kuthuthukiswe ukusebenza kahle kokutholwa. | |
|
Eminye imisebenzi yokulinganisa | ibanga | Chofoza amaphuzu amabili A no-B ukuze usethe umugqa wereferensi njengoba kudingeka, bese uchofoza phuzu C ukuze ulinganise ibanga eliqondile ukusuka kuphoyinti C ukuya emugqeni wereferensi. |
| Isilinganiso sebanga | Isetshenziswa kakhulu ukukala izinga lethayela le- through-hole lebhodi lesifunda.Iphuzu D libekwe ngaphezu kwebanga elilinganisiwe.Ibanga elima mpo ukusuka ephuzwini D ukuya emugqeni wereferensi lihlukaniswa ngebanga eliqondile lephoyinti C ukuze kutholwe isilinganiso sephesenti lebanga eliqondile lika-D ukuya ku-C. | |
| i-angle | Chofoza amaphuzu amabili A no-B ukuze usethe isisekelo njengoba kudingeka, bese uchofoza iphoyinti C ukuze ulinganise i-engeli phakathi kwemisebe ye-BA ne-BC. | |
| Umumo oyindilinga | Isetshenziswa kakhulu ukukala izingxenye eziyindilinga njengamabhola e-solder.Chofoza amaphuzu amathathu ukuze uqinisekise indilinga, futhi ulinganise isiyingi, indawo kanye neradiyasi. | |
| Isikwele | Isetshenziswa kakhulu ukukala izingxenye eziyisikwele, chofoza amaphuzu amabili ukuze uqinisekise isikwele, futhi ulinganise ubude, ububanzi nendawo. | |
|
ukutholwa okuzenzakalelayo | Setha indawo mathupha | Umsebenzisi angasetha noma yikuphi ukuma endaweni yesikhulumi njengendawo yokuthola, futhi isofthiwe izothatha ngokuzenzakalelayo futhi igcine isithombe. |
| Uhlu | Ngamaphoyinti okuhlola ngohlelo olujwayelekile, umsebenzisi udinga kuphela ukusetha izindawo ezimbili zokuhlola kanye nenani lemigqa namakholomu, futhi isofthiwe izothatha ngokuzenzakalelayo indawo ngayinye yokuhlola bese ilondoloza isithombe. | |
| Ukukhonjwa Okuzenzakalelayo | Ngamaphoyinti okutholwa anezici ezisobala, isoftware ingakwazi ukukhomba ngokuzenzakalelayo indawo ethile, yenza ukulinganisa, bese igcina isithombe. |
Isicelo
● BGA solder uxhumano
● ibhamuza le-BGA
● PCB Ngembobo ngethayela
● Amabhamuza e-IC nentambo yegolide
● Amabhamuza we-LED Welding
● Ukuphuka kwentambo yegolide ye-LED
● amandla
● Inductor
● Inzwa
● I-TSS yokukhishwa kwe-semiconductor
● Ipulasitiki ye-fiber yengilazi
● Ikhebula
● i-diode
● Igebe lokushisela ipayipi lensimbi
● I-chip yemoto
